Customized solutions
Ferrotec-RMT possesses extensive expertise in chip mounting, wire bonding and sealing in inert environments. We leverage these technologies to develop customized solutions tailored to specific customer requirements.Custom Optoelectronic Solutions Engineered for Your Mission
At Ferrotec-RMT, we don’t just manufacture components—we solve challenges. We partner with you to develop custom Transmission Optical Sub-Assemblies (TOSAs), sensors and detectors tailored to your exact requirements.
Your Vision, Our End-to-End Expertise
From prototype to high-volume production, we deliver complete solutions through our integrated capabilities:
- Precision Micro-Assembly: Chip mounting with using advanced bonding techniques (flux‑free soldering, epoxy, conductive glue) for PD, LD, MEMS and SMD components.
- Advanced Interconnection: Gold wire bonding (30, 25, 18 µm) and bonding of Pt, Cu, and other materials for reliable electrical connections in TECs, PDs and LDs.
- Custom Optics: Production of lids and windows from Ge, Si, Sapphire, Beryllium, and other materials—including AR coating—for any package type.
- Reliable Hermetic Sealing: Package sealing via welding, gluing or soldering in vacuum, nitrogen or argon environments.
- Comprehensive Validation & Analysis: Rigorous reliability and performance testing to ensure real‑world readiness:
- C‑SAM (Sonoscan) and X‑ray screening for internal integrity.
- Advanced Imaging & Material Analysis: X‑ray Tomography, X‑ray Fluorescence (XRF) and Scanning Electron Microscopy (SEM).
- Environmental & Stress Testing: Mechanical shock, thermal cycling and extended environmental exposure.
From concept to certified component, Ferrotec-RMT is your dedicated partner for custom optoelectronics.
For a tailored solution for your specific application, please contact our engineering team to discuss your project.